china electron beam lithography system
Release time:
2026-06-22
The Electron Beam Lithography system has evolved beyond pure research into a production‑ready tool for advanced semiconductor packaging, compound semiconductor devices,
ZEL304G Electron Beam Lithography System
Electron Beam Direct Write Lithography
The High-Precision Choice for Micro/Nano Structure Fabrication
ZEPTOOLS ZEL304G Electron Beam Lithography System is equipped with a high-performance field emission electron gun and a high-speed pattern generation system, enabling high-precision, high-resolution micro/nano structure lithography. The system features a high-precision laser interferometer sample stage, supporting large-range precise stitching and overlay alignment. It is compatible with various pattern formats and multi-layer automatic exposure, meeting complex micro/nano fabrication demands. Widely used in fields such as advanced physics, semiconductors, microelectronics, photonics, quantum research, and new material development, it provides a stable and reliable domestically developed solution for scientific innovation and high-end micro/nano processing.

Main Technical Parameters
The full series adapts to micro/nano processing needs – choose the high-performance electron beam lithography system that suits your requirements
Application Cases
Excellent Lithography Technology Meets Your Various Requirements

▲ Uniformity Test

▲ Field Stitching (Measured with Vernier Caliper) and Minimum Line Width Test

▲ HSQ Resist

▲ PMMA Resist

▲ Thick Resist Test

▲ Seamless Long Grating Stitching


▲ Electron Beam Proximity Effect Correction Function · Dose Correction Effect

▲ Combined DMD UV and Electron Beam Lithography [Models used: ZML10A and ZEL304G]
The Electron Beam Lithography system has evolved beyond pure research into a production‑ready tool for advanced semiconductor packaging, compound semiconductor devices, and high‑end reticle fabrication. Our new‑generation Electron Beam Lithography system features a variable‑shaped beam (VSB) column that increases writing throughput by 3× compared to conventional Gaussian systems, while preserving the hallmark resolution of any premium Electron Beam Lithography system. With a stage speed of up to 500 mm/s and beam current adjustable from 1 pA to 50 nA, this Electron Beam Lithography system accommodates everything from ultra‑dense logic layers to thick‑resist MEMS structures. The integrated pattern‑fracturing engine optimizes shot counts in real time, ensuring that the Electron Beam Lithography system delivers maximum productivity without sacrificing critical dimension uniformity. For foundries managing multiple product SKUs, this Electron Beam Lithography system eliminates mask inventory costs while enabling rapid design‐change turnarounds.
Intelligent automation sets this Electron Beam Lithography system apart, with an AI‑driven alignment module that recognizes global and local fiducial marks in under 100 milliseconds. This feature allows the Electron Beam Lithography system to handle warped or transparent substrates—common in wafer‑level packaging—with ±3nm registration accuracy. The system’s advanced dose‑correction algorithm compensates for resist sensitivity variations and pattern‑loading effects, ensuring that each Electron Beam Lithography system exposure delivers predictable results across 300mm wafers or 9‑inch reticles. Furthermore, the Electron Beam Lithography system includes an integrated helium ion microscope (HIM) option for simultaneous imaging and writing, making this Electron Beam Lithography system a multi‑functional nanofabrication platform. Remote job queuing, real‑time process monitoring, and SECS/GEM compliance turn this Electron Beam Lithography system into a true Industry 4.0‑ready asset for smart manufacturing lines.
To conclude, the Electron Beam Lithography system offers the ideal balance of resolution, speed, and automation for both R&D pilots and volume production. Its modular architecture allows field upgrades—from higher‑brightness cathodes to faster blankers—ensuring that your Electron Beam Lithography system remains competitive for over a decade. With a mean time between failures (MTBF) exceeding 8,000 hours and global service centers, this Electron Beam Lithography system minimizes operational disruptions. Whether you are producing advanced photonics, RF filters, or next‑gen memory devices, this Electron Beam Lithography system empowers your team to push the boundaries of miniaturization. Request a demo today to see how our Electron Beam Lithography system can transform your fabrication workflow—and experience why industry leaders trust this Electron Beam Lithography system for their most critical nanopatterning applications.
Related News