Ultraflat series Plasma Enhanced Chemical Vapor Deposition System (PECVD)

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Product Description

UltraflatTM series Plasma Enhanced Chemical Vapor Deposition System (PECVD) is the main technology used to prepare high-purity and high-performance solid films, mainly by ionizing the target gas with the help of microwave or radiofrequency, to promote the chemical reaction to proceed at a lower temperature, so as to deposit the desired thin film on the substrate.

At present, the CVD equipment developed by the project team can directly grow all kinds of new two-dimensional materials represented by graphene on a variety of substrates (e.g., metal, oxide, and semiconductor surfaces) for the research and development of new materials and devices. The process is simple and cheap, and has the compatibility of traditional semiconductor growth process.

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